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Microelectromechanical systems
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131	mems-tiltmeter-datasheet.fm Add to Reading List Source URL: www.slopeindicator.com Language: English - Date: 2014-08-25 13:03:45 Engineering Measurement Geotechnical engineering Tiltmeter Volcanology Sensors Microelectromechanical systems Data logger Anchor Technology Measuring instruments Transducers
132	el-data-recorder-datasheet.fm Add to Reading List Source URL: www.slopeindicator.com Language: English - Date: 2014-08-25 13:03:21 Microelectromechanical systems Microtechnology Transducers Data logger Electromagnetism Spreadsheet Engineering Technology Electrical engineering Mechanical engineering
133	Precision Resonant Vibratory MEMS Sensors Navigation and Science Karl Yee (JPL) JPL MEMS Gyroscope (K. Yee, J. Gill) Add to Reading List Source URL: www.lpi.usra.edu Language: English - Date: 2014-08-08 17:15:24 Engineering Microtechnology Avionics Inertial navigation system Microelectromechanical systems Fibre optic gyroscope Inertial measurement unit Accelerometer Ring laser gyroscope Technology Gyroscopes Aircraft instruments
134	Figure 4 Advantage of having smaller focal spot on CCD with super-fine pixels: Larger focal point compromises the sensitivity, spatial resolution, and accuracy. Figure 1 Typical microlens array for Shack-Hartmann Sensor Add to Reading List Source URL: www-bsac.eecs.berkeley.edu Language: English - Date: 2004-09-20 14:57:04 Technology Microlens Microelectromechanical systems Integral imaging Lens Deep reactive-ion etching Microtechnology Materials science Optics
135	letters to nature Thermally induced ultrasonic emission from porous silicon H. Shinoda, T. Nakajima, K. Ueno & N. Koshida Department of Electrical & Electronic Engineering, Tokyo University of Add to Reading List Source URL: www.hapis.k.u-tokyo.ac.jp Language: English - Date: 2001-12-17 00:38:38 Nitrides Superhard materials Energy harvesting Porous silicon Polycrystalline silicon Silicon dioxide Microelectromechanical systems Gallium nitride Silicon Chemistry Ceramic materials Transducers
136	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:24:22 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
137	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 03:08:02 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
138	2100 sD PPP_PPPplus -HR.pdf Add to Reading List Source URL: www.besi.com Language: English - Date: 2014-12-11 09:08:27 Technology Microelectromechanical systems Electromagnetism Physics Semiconductor device fabrication Microtechnology Wafer
139	Microsoft PowerPoint - AIT Testimonial.ppt Add to Reading List Source URL: www.cadit.com.sg Language: English - Date: 2012-10-10 04:07:56 Ansys Technology Piezoelectricity Asian Institute of Technology Microelectromechanical systems Transdermal patch Transducers Electromagnetism Physics
140	www.elettra.trieste.it Elettra Sincrotrone Trieste Deep X-Ray Lithography E Add to Reading List Source URL: www.elettra.trieste.it Language: English - Date: 2012-10-15 05:11:07 Electromagnetism Microtechnology ELETTRA Trieste X-ray lithography Microelectromechanical systems Synchrotron Beamline Physics Particle accelerators Materials science

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